TY  - GEN
AU  - Lau, John H.
AU  - Lee, S.W. Ricky
TI  - Microvias : for low cost high density interconnects
SN  - 0071363270
PY  - 2001///
CY  - New York
PB  - McGraw-Hill
KW  - SEMICONDUCTORS
KW  - ELECTRONIC ENGINEERING
ER  -