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Adhesive wafer bonding for microelectronic and microelectromechanical systems

By: Niklaus, FrankLanguage: English Publisher: Stockholm Royal Institute of Technology 2002Description: various paging : ill., tablesISBN: ISSN : [02812878]Subject(s): ADHESIVE WAFER BONDING | CMOS compatible | Thermoplastic | Thermosetting | Benzocyclobutene | Photoresist | Wafer-level

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Item type	Current location	Call number	Shelving info	Copy number	Status	Notes	Date due	Barcode	Item holds
Book	Library, University of Moratuwa The University of Moratuwa Library (UML) is one of the most prominent technology libraries in the country. Its main subject specializations are Engineering, Architecture and Information Technology. However, the library caters to the requirements of the membership by housing books and other materials of general interest as well. Thesis Collection	621.3.049.77 N5 (Browse shelf)	FU 79	LB/DON/59/2018	Not For Loan	Doctoral Thesis - Doctor of Philosophy , Microsystem Technology, Department of Signals, Sensors and Systems, Royal Institute of Technology, Stockholm		D196

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Previous	621.3(043) Optimization of multi agent based energy management systems using reinforcement learning for microgrids	621.3(043) Cost implications of rooftop solar PV with batteries on industrial and commercial customers in Sri Lanka	621.3(043) Financial implications of solar penetration for electricity generation in Sri Lanka	621.3.049.77 N5 Adhesive wafer bonding for microelectronic and microelectromechanical systems	621.3.049.77 P3 Modelling and analysis of interconnects for deep submicron systems- on-chip	621.3.072 A6 Self tuning techniques for load frequency control	621.3"10" 3) A Conceptual design for a tower type concentrating solar power plant near Hambantota	Next

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